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Tuesday, November 1, 2011

Chipbond Q4 shipments can be no price increase in quarter

Chipbond Q4 shipments can be no price increase in quarter (Central News Agency correspondent Zhongrong Feng Taipei November 2, 2011 Xinhua) LCD driver IC packaging and testing plant Chipbond (6147) that in the fourth quarter without any price-cutting strategy, 8-inch gold bump and a large volume of COF can flat out, 12-inch gold bumps and small size COG quarter shipments are expected to increase. Chipbond GreTai today to participate in the securities market performance briefings, legal Chipbond asked whether the fourth quarter will continue to cut prices to grab a single strategy, ...Chipbond Q4 shipments can be no price increase in quarter

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